DY-E801 HIGH-TEMPERATURE-RESISTANT STRUCTURAL ADHESIVE

1. Properties

DY-E801 HIGH TEMPERATURE RESISTANT STRUCTURAL ADHESIVE is a two-component epoxy-based high-temperature-resistant  structural adhesive. It is characterized with high bonding strength, resistance to water, oil, acid and alkali media, and excellent electrical insulation. It works at low temperature down to -50°C and at high temperature up to 120°C-150°C. It is suitable for mechanical operation due to its thixotropy.

 

2. Applications

DY-E801 HIGH TEMPERATURE RESISTANT STRUCTURAL ADHESIVE is suitable for bonding electronic apparatus, electromechanical appliances, and solar panels. It can also help to self-bond and inter-bond copper, aluminum, steel, iron, stainless steel, lead, and tin.  

 

3. Directions

• Mix components A and B at the ratio of 1∶1 in weight. The mixed adhesive should be used up within 1 hour.
• Surfaces of the substrates must be cleaned, and dried. Metals like copper, steel should be cleaned with acetone, and they must be dry before the adhesive is applied.  
• Initial cure can be reached within 3-5 hours. To speed up its curing, the substrates, which have been bonded for half an hour, can stay in an oven at 80°C for 30 minutes for its final cure. Bonded substrates can be used after 24 hours. At low temperature and humid condition, it is suggested to heat the adhesive up to 20°C for its bonding effect.
• Bonded substrates must be fixed with the help of the clamping tools while the adhesive cures.  
• In case of vertical or overhead application of adhesive, bonded substrates must be fixed with double sided adhesive tapes and 502 super glue.

• Store the adhesive in shady, dry, well-ventilated, damp-proofing places。
• Store the adhesive at room temperature.
• Keep away from any source of ignition.  

• The adhesive is irritable to skin and eyes. 
• Keep out of reach of children.
• In case of skin or eye contact, flush with water and seek medical treatment immediately if necessary.

 

5. Parameters